GUOWIN's R&D team has successfully developed and commercialized a new ultra-fine nano grinding series — the SC-Nano Line — featuring grit sizes from P8000 to P12000 (with equivalent F-series designations down to F2000). These products enable sub-micron surface roughness for applications in optics, semiconductor wafer processing, and precision hardware.
Technical Achievements
Traditional ultra-fine polishing of optical components and semiconductor wafers relies on loose abrasive slurries, which present challenges in consistency, contamination control, and process stability. The SC-Nano Line changes this equation by incorporating precisely engineered fixed-abrasive technology that delivers:
- Surface Roughness: Ra < 0.05 µm achievable on appropriate substrates
- Consistency: Within-batch variation < 5% (vs. 15–20% with loose slurries)
- Contamination: Significantly reduced embedded contamination due to controlled abrasive release
- Process Window: Wider operating window for speed and pressure combinations
Target Applications
- Optical Lenses: Final polishing of glass and polycarbonate optical elements for cameras, microscopes, and medical devices
- Semiconductor Wafers: Back-side grinding and final polishing of silicon and compound semiconductor wafers
- Precision Hardware: Shafts, bearings, and mating surfaces requiring nano-scale finishes
- Medical Devices: Implants and surgical instruments requiring biocompatible surface finishes
Product Configurations
The SC-Nano Line is available in multiple formats: SC-Nano sheet (for soft polishing discs), SC-Nano film (for planar surfaces), and SC-Nano compound (pre-mixed slurries for specialized applications). Custom configurations for specific substrates are available through Gnosel application engineering.
Contact Support@guowin.com.cn for technical specifications and sample requests.